Posted On: 14 MAY 2025 New Delhi: In a major boost to India’s semiconductor ecosystem, the Union Cabinet chaired by Prime Minister Shri Narendra Modi today approved the establishment of a new semiconductor unit in Uttar Pradesh, under the ambitious India Semiconductor Mission.
This marks the sixth semiconductor unit in the country, with five already in advanced stages of construction. The new facility, to be set up near Jewar Airport in the Yamuna Expressway Industrial Development Authority (YEIDA) region, is a joint venture between HCL and Foxconn.
HCL brings its legacy of hardware innovation, while Foxconn, a global leader in electronics manufacturing, adds its cutting-edge capabilities to the project. The plant will focus on manufacturing display driver chips used in mobile phones, laptops, automobiles, PCs, and other digital devices.
Designed to produce 20,000 wafers per month, the facility will have a design output capacity of 36 million chips per month, and will attract an investment of ₹3,700 crore.
This development represents continued momentum in India’s efforts to build a self-reliant and globally competitive semiconductor industry. The sector is expanding rapidly across the country with world-class design facilities emerging in multiple states.
Currently, students and entrepreneurs from 270 academic institutions and 70 startups are actively engaged in cutting-edge semiconductor design. Notably, 20 student-developed products have already been taped out by the Semiconductor Laboratory (SCL), Mohali.
With global majors like Applied Materials, Lam Research, Merck, Linde, Air Liquide, and Inox also strengthening their footprint in India, the ecosystem is aligning with the rising domestic demand in sectors such as mobile phones, servers, medical devices, defence equipment, and consumer electronics.
This latest initiative reinforces Prime Minister Modi’s vision of a technologically advanced and Atmanirbhar Bharat (self-reliant India).
